Method of testing circuit elements on a semiconductor wafer

ABSTRACT

A semiconductor device test apparatus according to the present invention includes a circuit board  103  and a film  105 . A plurality of electrodes  103   c  are formed at the circuit board  103  at positions that face opposite a plurality of electrodes  201   a  at a device to be measured  201 , whereas bumps  105   b  are formed at the surface of the film  105  located toward the device to be measured  201 , at positions that face opposite the plurality of electrodes  201   a  at the device to be measured  201  and electrodes  105   c  are formed at the surface of the film  105  located toward the circuit board  103  at positions that face opposite the plurality of electrodes  103   c  at the circuit board  103 . The bumps  105   b  formed at one surface of the film  105  and the electrodes  105   c  formed at another surface of the film  105  are electrically connected with each other via through holes  105   d  to support semiconductor devices having electrodes provided at a fine pitch and to improve durability.

This application is a divisional application of application Ser. No.10/279,988, filed on Oct. 25, 2002, which is a divisional application ofapplication Ser. No. 09/904,663, filed on Jul. 16, 2001 and issued onApr. 12, 2005 as U.S. Pat. No. 6,879,169, which is a divisionalapplication of application Ser. No. 09/434,490, filed on Nov. 5, 1999and issued on Jun. 18, 2002 as patent U.S. Pat. No. 6,407,563.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device test method.

An IC socket that matches the shape of the device to be measured isemployed to test a newly developed device in the prior art. An ICsocket, which comes into electrical contact with the device to bemeasured, fulfills a function as a means for electrical signalcommunication between a peripheral device and the device to be measured.

Now, the IC socket, the device to be measured and the connection betweenthe IC socket and the device to be measured are explained in referenceto FIGS. 29, 30 and 31.

FIG. 29 is a sectional view of a device to be measured 1 and an ICsocket 3 mounted at a circuit board 5, illustrating the connectionsamong them. The IC socket 3 is provided with a plurality of contacts 3a, and is soldered onto the circuit board 5 at the contacts 3 a. Thedevice to be measured 1, which is pressed down by a holding member 7, iselectrically connected with the contacts 3 a of the IC socket 3.

FIG. 30 is a perspective of the device to be measured 1, showing itssurface on which electrodes are formed. The device to be measured 1 is aCSP (chip-size package) device achieved through chip size packaging. Thedevice to be measured 1 is provided with a plurality of electrodes 1 athrough which electrical signals are input and output and power issupplied. The individual contacts 3 a provided at the IC socket 3 arepositioned so that they come in contact with the correspondingelectrodes 1 a.

FIG. 31 is a plan view of the circuit board 5 with the devices to bemeasured 1 and the IC sockets 3 mounted, viewed from above. The circuitboard 5 is allowed to engage in electrical signal communication withperipheral devices such as an IC tester and a burn-in apparatus (notshown) via connection terminals 5 a and 5 b.

With the devices to be measured 1, the IC socket 3 and the circuit board5 configured as described above, electrical signals input to the circuitboard 5 from peripheral devices via the connection terminals 5 a and 5 band a source voltage travel through the contacts 3 a of the IC socket 3to be supplied to the devices to be measured 1 through the electrodes 1a. In addition, electrical signals output by the devices to be measured1 travel through the reverse route to reach the peripheral devices. Suchan electrical connection enables functional tests on the devices 1 to bemeasured.

Apart from functional tests achieved by employing IC sockets asdescribed above, a functional test on a wafer-level device, inparticular, is implemented by adopting a method whereby probes areplaced in contact with wafer pads constituting signal input/outputelectrodes and source electrodes of the device.

Since the wafer and the probes are placed in contact a great number oftimes in such functional tests employing probes, the contact durabilityof the probe is a critical concern. If the contact durability of theprobes is poor, the cost of the functional test is bound to increase,raising the price of the device itself. For this reason, probes arenormally constituted of materials with a high degree of hardness such astungsten and beryllium copper.

FIG. 32 illustrates a probe card 13 provided with probes 11. At theprobe card 13, a specific circuit that corresponds to the device to bemeasured is printed, and electrical signal communication with peripheraldevices (not shown) is enabled via connection terminals 13 a and 13 b.

The positional relationship between a probe card 13 and the wafer 15which constitutes the device to be measured is illustrated in FIG. 33.Electrical signals provided by a peripheral device are input to theprobe card 13 via the connection terminals 13 a and 13 b, travel throughthe circuit formed at the probe card 13 to reach the probe 11. Then, theelectrical signals are applied to the pads formed at the wafer 15 fromthe probe 11. In addition, electrical signals output by the wafer 15travel through the reverse route to reach a peripheral device. Thestructure described above enables a functional test on the wafer 15.

However, the following problems are yet to be addressed in functionaltests conducted by utilizing IC sockets and functional tests conductedby utilizing probes.

The smallest pitch for contacts at an IC socket is currently 0.65 mm. Atthe same time, the package size has been reduced in recent years, withthe CSP being a typical example, and as a result, the electrode pitch atthe device has been switched from 1.27 mm to 0.8 mm or 0.5 mm. Thisreduction in the electrode pitch at the device necessitates a reductionin the pitch of the contacts at the IC socket.

However, in order to reduce the contact pitch at an IC socket to 0.65 mmor smaller, the IC socket machining accuracy must be improved. This willinevitably raise the production cost of the IC socket, and may result ina large increase in the device price.

In addition, the body size of IC sockets imposes a restriction upon thenumber of IC sockets that can be mounted at a circuit board. Suchrestriction on the number of IC sockets that can be mounted at thecircuit board ultimately restricts the number of devices that can betested in a single functional test. Thus, functional tests conducted ondevices utilizing IC sockets in the prior art are not always efficient.

In order to achieve a higher degree of efficiency in functional testsconducted by employing probes, it is desirable to increase the number ofprobes mounted at a probe card so that many devices can be tested atonce. However, probes are secured to the probe card using a resin or thelike in the prior art, which requires a large space for securing them.Thus, it is difficult to increase the number of probes withoutincreasing the probe card size.

Furthermore, as higher integration of devices becomes more common, thepitch of the device pads with which probes come in contact is becomingnarrower. This reduction in the pad pitch necessitates a reduction inthe pitch of probes mounted at the probe card. However, it is difficultto reduce the probe pitch in the structure adopted in the prior art.

SUMMARY OF THE INVENTION

An object of the present invention, which has been completed byaddressing the problems of the prior art discussed above, is to providea semiconductor device test apparatus that can be employed to testsemiconductor devices with electrodes provided at a fine pitch and alsoachieves a high degree of durability. Another object of the presentinvention is to provide a semiconductor device test apparatus that iscapable of batch testing a great number of semiconductor devices.

In order to achieve the objects described above, according to thepresent invention, a semiconductor device test apparatus that is capableof testing one or a plurality of semiconductor devices each providedwith a plurality of electrodes. The semiconductor device test apparatusaccording to the present invention is characterized in that it isprovided with a circuit board having a circuit that corresponds to thesemiconductor device and a plurality of electrodes that correspond toindividual electrodes at the semiconductor device and a connection platethat is provided with a plurality of conductive portions thatelectrically connect the individual electrodes at the semiconductordevice and the individual electrodes at the circuit board on aone-to-one basis. This structure allows the semiconductor device to beelectrically connected to the circuit board via the connection plate.The semiconductor device can be driven by inputting various types of-electrical signals to the circuit board from peripheral devices, andvarious types of electrical signals output by the semiconductor deviceare communicated to the peripheral devices. In addition, by providingthe connection plate having a plurality of conductive portions providedto electrically connect the individual electrodes at the semiconductordevice and the individual electrodes at the circuit board, an extremelysimple structure is realized for the apparatus.

The conductive portions are each formed at one of a plurality of throughholes provided at the connection plate. Even when electrodes at thesemiconductor device are arrayed over an extremely fine pitch, thesemiconductor device can be tested with ease by reducing the electrodepitch at the circuit board and reducing the through hole pitch.

A conductive elastic body that electrically connects the individualconductive portions at the connection plate and the individualelectrodes at the semiconductor device on a one-to-one basis is providedbetween the connection plate and the semiconductor device. By adoptingthis structure, the pressure applied by the conductive portions at theconnection plate to the individual electrodes at the semiconductordevice when they are electrically connected with each other is reduced.The structure may be effectively adopted when, for instance, theelectrodes at the semiconductor device are ball-type electrodes.

Furthermore, a positioning member that secures the semiconductor devicemay be provided. This positioning member may be constituted of a platemember having a through portion formed that corresponds to the shape ofthe semiconductor device, for instance. Such a configuration will allowthe semiconductor device to be secured through an extremely simplestructure. In addition, the space required to secure the semiconductordevice can be reduced.

Moreover, the circuit board, the connection plate and the positioningmember may be provided as an integrated unit, or the circuit board, theconnection plate, the conductive elastic body and the positioning membermay be provided as an integrated unit. Such a structure eliminates thenecessity for assembling the circuit board, the connection plate and thepositioning member when testing the semiconductor device, to achieve ahigher degree of efficiency in testing.

By providing a holding member that presses the semiconductor devicetoward the connection plate, the position of the semiconductor devicebecomes fixed and more reliable electrical connection is achieved forthe semiconductor device and the circuit board.

It is desirable to provide a buffer member at the location where theholding member is in contact with the semiconductor device. By providingsuch a buffer member, the pressure applied from the holding member isdistributed evenly and correctly at the semiconductor device.

By using film to constitute the connection plate, an extremely thinconnection plate is realized. In addition, since the connection plateconstituted of film can bend freely, more reliable electrical connectionbetween the individual electrodes at the semiconductor device and theindividual electrodes at the circuit board is assured.

Alternatively, a printed board may be used to constitute the connectionplate. By adopting such a printed board, the production cost can bereduced compared to the cost of production using film.

In addition, according to the present invention, a semiconductor devicetest apparatus employed to test one or a plurality of semiconductordevices each having a plurality of electrodes, which is characterized inthat it is provided with a probe holding member having a plurality ofprobes fitted therein so that the individual sharp ends of the pluralityof probes corresponding to the individual electrodes at thesemiconductor device on a one-to-one basis and the ends of the probeslocated on the other side of the sharp ends are exposed. By adoptingthis structure, it becomes possible to mount a plurality of probes whilerequiring only a small area, so that finer pitches for electrodes at thesemiconductor device can be supported.

By forming notched portions in an area located inside the probe holdingmember, the individual probes can be held by the probe holding memberwith a high degree of reliability.

In addition, by providing a plurality of conductive elastic portions,each corresponding to one of the probes, the sharp ends of the probescan be placed in contact with the semiconductor device with a highdegree of reliability.

It is desirable to form a gold-clad film, at least in areas where theindividual probes come into contact with the conductive elasticportions. This gold-clad film will prevent the formation of an oxidefilm to assure good electrical continuity between the probes and theconductive elastic portions to allow the flow of a very weak current.

Furthermore, according to the present invention, a chip or a wafer maybe used as the semiconductor device to be tested.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the invention and the concomitantadvantages will be better understood and appreciated by persons skilledin the field to which the invention pertains in view o the followingdescription given in conjunction with the accompanying drawings whichillustrate preferred embodiments.

FIG. 1 is a perspective illustrating the structure of the semiconductordevice test apparatus in a first embodiment;

FIG. 2 is a sectional view of the semiconductor device test apparatus inFIG. 1;

FIG. 3 is an enlargement of the sectional view of the semiconductordevice test apparatus in FIG. 2;

FIG. 4 is a sectional view illustrating the structure of thesemiconductor test apparatus in a second embodiment;

FIG. 5 is an enlargement of the sectional view of the semiconductordevice test apparatus in FIG. 4;

FIG. 6 is a sectional view illustrating the structure of thesemiconductor test apparatus in a third embodiment;

FIG. 7 is a perspective illustrating the structure of the semiconductordevice test apparatus in a fourth embodiment;

FIG. 8 is a sectional view of the semiconductor device test apparatus inFIG. 7;

FIG. 9 is an enlargement of the sectional view of the semiconductordevice test apparatus in FIG. 8;

FIG. 10 is a sectional view illustrating the structure of thesemiconductor test apparatus in the fifth embodiment;

FIG. 11 is an enlargement of the sectional view of the semiconductordevice test apparatus in FIG. 10;

FIG. 12 is a sectional view illustrating the structure of thesemiconductor test apparatus in the sixth embodiment;

FIG. 13 is a perspective illustrating the structure of the semiconductordevice test apparatus in a seventh embodiment;

FIG. 14A and 14B are plan views of a wafer to be measured that may betested by the semiconductor device test apparatus illustrated in FIG.13;

FIG. 15 is a sectional view of a CSP device obtained from the wafer tobe measured in FIG. 14;

FIG. 16 is a sectional view illustrating the semiconductor device testapparatus in FIG. 13 immediately before the wafer to be measured in FIG.14 is fitted;

FIG. 17 is a sectional view illustrating the semiconductor device testapparatus in FIG. 13 with the wafer to be measured in FIG. 14 fitted;

FIG. 18 is an enlargement of the sectional view of the semiconductordevice test apparatus in FIG. 17;

FIG. 19 is a perspective illustrating the structure of the semiconductordevice test apparatus in an eighth embodiment;

FIG. 20A and 20B are plan views of a wafer to be measured that may betested by the semiconductor device test apparatus illustrated in FIG.19;

FIG. 21 is a sectional view of a CSP device obtained from the wafer tobe measured in FIG. 20;

FIG. 22 is a sectional view illustrating the semiconductor device testapparatus in FIG. 19 immediately before the wafer to be measured in FIG.20 is fitted;

FIG. 23 is a sectional view illustrating the semiconductor device testapparatus in FIG. 19 with the wafer to be measured in FIG. 20 fitted;

FIG. 24 is an enlargement of the sectional view of the semiconductordevice test apparatus in FIG. 23;

FIG. 25 is a perspective illustrating the structure of the semiconductordevice test apparatus in a ninth embodiment;

FIG. 26 is an enlargement of the sectional view of the semiconductordevice test apparatus in FIG. 25;

FIG. 27 is a plan view of an IC chip that may be tested by using thesemiconductor device test apparatus in FIG. 25;

FIG. 28 is a sectional view illustrating a state in which the IC chip inFIG. 27 is in contact with the semiconductor device test apparatusillustrated in FIG. 25;

FIG. 29 is a sectional view illustrating the connections among a deviceto be measured, an IC socket and a circuit board in the prior art;

FIG. 30 is a perspective of the device to be measured in FIG. 29,illustrating its surface where electrodes are formed;

FIG. 31 is a plan view of a circuit board with the devices to bemeasured and the IC sockets in FIG. 29 mounted;

FIG. 32 is a plan view of a probe card 13 provided with probes of theprior art;

FIG. 33 is a sectional view illustrating a state in which the wafer isin contact with the probes provided at the probe card illustrated inFIG. 32

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following is a detailed explanation of the preferred embodiments ofthe semiconductor device test apparatus according to the presentinvention, given in reference to the attached drawings. It is to benoted that in the following explanation and the attached drawings, thesame reference numbers are assigned to components having practicallyidentical functions and structural features to preclude the necessityfor repeating the explanation thereof.

First Embodiment

As illustrated in FIG. 1, a semiconductor device test apparatus e1 inthe first embodiment of present invention adopts a structure thatincludes a circuit board 103, a film 105, a positioning plate 107 and aholding plate 109.

The circuit board 103, which is connected to peripheral devices (notshown) via connection terminals 103 a and 103 b, enables input andoutput of various types of electrical signals and a source voltage. Thecircuit board 103 may be constituted of, for instance, a multilayersubstrate.

The film 105, the positioning plate 107 and the holding plate 109 arerespectively provided with reference holes 105 a, 107 a and 109 a at thefour corners, and they are secured onto the circuit board 103 by pins111.

The positioning plate 107 is provided with a plurality of through holes107 b constituting positioning members so that it can align devices tobe measured 201. The through holes 107 b are formed in a shape thatcorresponds to the external shape of the devices to be measured 201.

FIG. 2 is a sectional view illustrating the semiconductor device testapparatus e1 in the first embodiment and a plurality of devices to bemeasured 201 fitted at the semiconductor device test apparatus e1 forthe purpose of various types of functional tests. The devices to bemeasured 201 are each inserted at a through hole 107 b at thepositioning plate 107 and are held against the film 105 by the holdingplate 109. In addition, a buffer member 113 is provided between eachdevice to be measured 201 and the holding plate 109 to ensure that thepressure from the holding plate 109 is distributed to the individualdevices to be measured 201 evenly and correctly. Furthermore, the film105 is held against the circuit board 103 with the pressure applied bythe holding plate 109.

Now, the connections among the devices to be measured 201, the film 105and the circuit board 103 are explained in reference to FIG. 3, which isan enlargement of FIG. 2.

At the circuit board 103, a plurality of electrodes 103 c are formed atpositions that face opposite a plurality of electrodes 201 a at thedevice to be measured 201.

Bumps 105 b are formed at the surface of the film 105 located toward thedevice to be measured 201, at positions that face opposite the pluralityof electrodes 201 a at the device to be measured 201. These bumps 105 b,which are terminals capable of supplying source voltage andinputting/outputting various types of electrical signals, are eachformed in a semi-spherical shape through electrolytic plating. They maybe constituted of, for instance, copper, with their surfaces processedin a gold plating treatment. Alternatively, instead of the bumps,projections may be formed through etching.

Electrodes (lands) 105 c are formed at the surface of the film 105located toward the circuit board 103, at positions facing opposite theplurality of electrodes 103 c at the circuit board 103. The bumps 105 band the electrodes 105 c formed at different surfaces of the film 105are electrically connected via through holes 105 d.

When conducting a functional test on the devices to be measured 201,various types of electrical signals output by peripheral devices (notshown) and the source voltage are input to the circuit board 103 via theconnection terminals 103 a and 103 b, travel through the wiring circuitformed at the circuit board 103 and reach the electrodes 103 c. Asillustrated in FIGS. 2 and 3, the electrodes 103 c are electricallyconnected with the electrodes 201 a formed at the devices to be measured201 via the electrodes 105 c and the bumps 105 b formed at the film 105.Consequently, various types of electrical signals output by theperipheral devices and the source voltage are provided to the devices tobe measured 201 to electrically drive the devices to be measured 201. Inaddition, the various types of electrical signals output by the devicesto be measured 201 travel through the bumps 105 b and the electrodes 105c formed at the film 105, are taken into the circuit board 103 via theelectrodes 103 c and are further sent out to the peripheral devices.

When the semiconductor device test apparatus e 1 in the first embodimentstructured as described above, which does not include any contactsformed through machining as an IC sockets 3 in the prior art is adopted,a reduction in the pitch of the plurality of electrodes 201 a formed ateach device to be measured 201 can be supported. For instance, even whenthe pitch of the electrodes 201 a is equal to or less than 0.5 mm,functional tests can be conducted on the devices to be measured 201.

In addition, the semiconductor device test apparatus e1 in the firstembodiment, which is provided with the positioning plate 107 capable ofaligning a plurality of devices to be measured 201 in a batch, does notrequire an IC socket to be provided for each device to be measured 201.Thus, the expense of providing IC sockets is eliminated. In addition, byusing the area on the circuit board 103 which is occupied by the bodyportions of the IC sockets in the prior art, a larger number of devicesto be measured 201 can be mounted at the circuit board 103 so that evenmore devices to be measured can be tested in a single functional test.

Second Embodiment

FIG. 4 is a sectional view illustrating a semiconductor device testapparatus e2 in the second embodiment of the present invention and aplurality of devices to be measured 201 that are fitted at thesemiconductor device test apparatus e2 for the purpose of various typesof functional tests. The semiconductor device test apparatus e2 in thesecond embodiment adopts a structure that is achieved by replacing thefilm 105 in the semiconductor device test apparatus e1 in the firstembodiment with a printed board 115, as illustrated in FIG. 4.

The devices to be measured 201 are each inserted at a through hole 107 bat the positioning plate 107 and are held against the printed board 115by the holding plate 109. In addition, a buffer member 113 is providedbetween each device to be measured 201 and the holding plate 109 toensure that the pressure from the holding plate 109 is distributed tothe individual devices to be measured 201 evenly and correctly.Furthermore, the printed board 115 is held against the circuit board 103with the pressure applied by the holding plate 109.

Now, the connections among a device to be measured 201, the printedboard 115 and the circuit board 103 are explained in reference to FIG.5, which is an enlargement of FIG. 4.

Bumps 115 b are formed at the surface of the printed board 115 locatedtoward the device to be measured 201, at positions that face oppositethe plurality of electrodes 201 a at the device to be measured 201.These bumps 115 b, which are terminals capable of supplying the sourcevoltage and inputting/outputting various types of electrical signals,are each formed in a semi-spherical shape through electrolytic plating.They may be constituted of, for instance, copper, with their surfacesprocessed in a gold plating treatment. Alternatively, instead of thebumps, projections may be formed through etching.

Electrodes (lands) 11 5 c are formed at the surface of the printed board115 located toward the circuit board 103, at positions facing oppositethe plurality of electrodes 103 c at the circuit board 103. The bumps115 b and the electrodes 115 c formed at different surfaces of theprinted board 115 are electrically connected via through holes 115d.

When conducting a functional test on the devices to be measured 201,various types of electrical signals output by peripheral devices (notshown) and the source voltage are input to the circuit board. 103 viathe connection terminals 103 a and 103 b, travel through the wiringcircuit formed at the circuit board 103 and reach the electrodes 103c.As illustrated in FIGS. 4 and 5, the electrodes 103 c are electricallyconnected with the electrodes 201 a formed at the devices to be measured201 via the electrodes 115 c and the bumps 115 b formed at the printedboard 115. Consequently, various types of electrical signals output bythe peripheral devices and the source voltage are provided to thedevices to be measured 201 to electrically drive the devices to bemeasured 201. In addition, the various types of electrical signalsoutput by the devices to be measured 201 travel through the bumps 115 band the electrodes 115 c formed at the printed board 115, are taken intothe circuit board 103 via the electrodes 103 c and are further sent outto the peripheral devices.

As explained above, the semiconductor device test apparatus e2 in thesecond embodiment achieves advantages similar to those achieved by thesemiconductor device test apparatus e1 in the first embodiment.

In addition, the semiconductor device test apparatus e2 in the secondembodiment which is provided with the printed board 115 to electricallyconnect the devices to be measured 201 and the circuit board 103achieves a reduction in cost relative to the semiconductor device testapparatus e1 in the first embodiment provided with the film 105.

Third Embodiment

A semiconductor device test apparatus e3 in the third embodiment of thepresent invention assumes a structure that includes the circuit board103, the printed board 115, the positioning plate 107, the holding plate109 and the buffer member 113 that constitute the semiconductor devicetest apparatus e2 in the second embodiment, as illustrated in FIG. 6.

However, in the semiconductor device test apparatus e3 in the thirdembodiment, the circuit board 103, the printed board 115 and thepositioning plate 107 are integrated to constitute a first unit 121, andthe holding plate 109 and the buffer member 113 are integrated toconstitute a second unit 122.

When conducting a functional test on the devices to be measured 201, thedevices to be measured 201 are each housed inside a device-securingportion 121 a which is created by a through hole 107 b at thepositioning plate 107 constituting the first unit 121. The devices to bemeasured 201 are pressed down by the second unit 122 to be electricallyconnected with the printed board 115 constituting the first unit 121. Inaddition, since the printed board 115 is already electrically connectedwith the circuit board 103, electrical signals output by the peripheraldevices and the source voltage are provided to the devices to bemeasured 201, and the electrical signals output by the devices to bemeasured 201 are communicated to the peripheral devices.

As explained above, the semiconductor device test apparatus e3 in thethird embodiment achieves advantages similar to those achieved by thesemiconductor device test apparatus e2 in the second embodiment.

In addition, since the semiconductor device test apparatus e3 in thethird embodiment is constituted of the first unit 121 achieved byintegrating the circuit board 103, the printed board 115 and thepositioning plate 107 and the second unit 122 achieved by integratingthe holding plate 109 and the buffer members 113, it is not necessary toassemble the circuit board 103, the printed board 115, the positioningplate 107, the holding plate 109 and the buffer members 113 to test thedevices to be measured 201 and consequently, functional tests can beconducted on the devices to be measured by -taking a procedure similarto that adopted when conducting functional tests using IC sockets in theprior art. Consequently, a higher degree of efficiency is achieved infunctional tests and a reduction in the cost of the tests is achieved.

It is to be noted that in the semiconductor device test apparatus e3 inthe third embodiment, the printed board 115 may be replaced by the film105 provided in the semiconductor device test apparatus e1 in the firstembodiment.

Fourth Embodiment

A semiconductor device test apparatus e4 in the fourth embodiment of thepresent invention assumes a structure that includes the circuit board103, a film 106, a rubber sheet 131, the positioning plate 107 and theholding plate 109 as illustrated in FIG. 7. Namely, the semiconductordevice test apparatus e4 in the fourth embodiment assumes a structureachieved by replacing the film 105 in the semiconductor device testapparatus e1 in the first embodiment with the film 106 and by adding therubber sheet 131.

The film 106 and the rubber sheet 131 are respectively provided withreference holes 106 a and 131 a at the four corners and they are securedonto the circuit board 103 together with the positioning plate 107 andthe holding plate 109 by the pins 111.

It is to be noted that FIG. 7 shows a device to be measured 202. Likethe devices to be measured 201 described earlier, the devices to bemeasured 202 are CSP devices, and in addition, they each constitute aBGA (ball grid array). The positioning plate 107 is provided with aplurality of through holes 107 b constituting positioning portions toenable positioning of the devices to be measured 202. The through holes107 b are shaped to conform to the external shape of the devices to bemeasured 202.

FIG. 8 is a sectional view illustrating the semiconductor device testapparatus e4 in the fourth embodiment and a plurality of devices to bemeasured 202 fitted at the semiconductor device test apparatus e4 forthe purpose of various types of functional tests. The devices to bemeasured 202 are each inserted at a through hole 107 b at thepositioning plate 107 and are held against the rubber sheet 131 by theholding plate 109. In addition, a buffer member 113 is provided betweeneach device to be measured 202 and the holding plate 109 to ensure thatthe pressure from the holding plate 109 is distributed to the individualdevices to be measured 202 evenly and correctly. Furthermore, the rubbersheet 131 is held against the film 106 with the pressure applied by theholding plate 109 and the film 106 is held against the circuit board103.

Now, the connections among the device to be measured 202, the rubbersheet 131, the film 106 and the circuit board 103 are explained inreference to FIG. 9 which is an enlargement of FIG. 8.

The device to be measured 202, which is a BGA, as explained earlier, isprovided with the plurality of solder balls constituting electrodes 202a.

At the circuit board 103, a plurality of electrodes 103 c are formed atpositions that face opposite a plurality of electrodes 202 a at thedevice to be measured 202.

Electrodes 106 b are formed at the surface of the film 106 locatedtoward the rubber sheet 131. At the surface of the film 106 locatedtoward the circuit board 103, electrodes 106 c are formed at positionsfacing opposite the plurality of electrodes 103 c at the circuit board103. The electrodes 106 b and the electrodes 106 c formed at differentsurfaces of the film 106 are electrically connected via through holes106 d.

The rubber sheet 131 is provided with anisotropic conductive rubberportions 131 b at positions facing opposite the electrodes 106 b at thefilm 106 and the electrodes 202 a at the device to be measured 202.

When conducting a functional test on the devices to be measured 202,various types of electrical signals output by peripheral devices (notshown) and the source voltage are input to the circuit board 103 via theconnection terminals 103 a and 103 b, travel through the wiring circuitformed at the circuit board 103 and reach the electrodes 103 c. Asillustrated in FIGS. 8 and 9, the electrodes 103 c are electricallyconnected with the anisotropic conductive rubber portions 131 b embeddedin the rubber sheet 131 via the electrodes 106 c and the bumps 106 bformed at the film 106. In addition, the anisotropic conductive rubberportions 131 b are electrically connected with the electrodes 202 aformed at the devices to be measured 202. Consequently, various types ofelectrical signals output by the peripheral devices and the sourcevoltage are provided to the devices to be measured 202 to electricallydrive the devices to be measured 202. The various types of electricalsignals output by the devices to be measured 202 travel through theanisotropic conductive rubber portions 131 b embedded in the rubbersheet 131 and the electrodes 106 b and 106 c formed at the film 106 tobe taken into the circuit board 103 via the electrodes 103 c and arefurther sent out to the peripheral devices.

When the semiconductor device test apparatus e4 in the fourth embodimentstructured as described above, which does not include any contactsformed through machining as in the IC sockets 3 in the prior art isadopted, a reduction in the pitch of the plurality of electrodes 202 aformed at each device to be measured 202 can be supported, as in thecase of the semiconductor test apparatus e1 in the first embodiment. Forinstance, even when the pitch of the electrodes 202 a is equal to orless than 0.5 mm, functional tests can be conducted on the devices to bemeasured 202.

In addition, the semiconductor device test apparatus e4 in the fourthembodiment, which is provided with the positioning plate 107 capable ofaligning the plurality of devices to be measured 202 in a batch, doesnot require an IC socket to be provided for each device to be measured202. Thus, the expense of providing IC sockets is eliminated. Inaddition, by using the area on the circuit board 103 which is occupiedby the body portion of the IC sockets in the prior art, a larger numberof devices to be measured 202 can be mounted at the circuit board 103 sothat even more devices to be measured can be tested in a singlefunctional test.

It is to be noted that it is necessary to take into consideration apossible deformation of the ball-shaped electrodes when conductingvarious types of functional tests on BGAs such as the devices to bemeasured 202. In the case of the semiconductor device test apparatus e4in the fourth embodiment, which is provided with the rubber sheet 131that achieves elasticity and at the same time enables electricalconnection only in the thicknesswise direction, the electrodes 202 aformed at the devices to be measured 202 do not become deformed. Theanisotropic conductive rubber portions 131 b provided at the rubbersheet 131 come in contact with the ball-shaped electrodes 202 a providedat the devices to be measured 202 over a larger area due to theirelasticity. Thus, when the semiconductor device test apparatus e4 in thefourth embodiment is employed, the individual devices to be measured 202achieve reliable electrical connection with the peripheral devices toenable functional tests to be performed with a higher degree ofaccuracy.

Fifth Embodiment

FIG. 10 is a sectional view illustrating a semiconductor device testapparatus e5 in the fifth embodiment of the present invention and aplurality of devices to be measured 202 that are fitted at thesemiconductor device test apparatus e5 for the purpose of various typesof functional tests. The semiconductor device test apparatus e5 in thefifth embodiment adopts a structure that is achieved by replacing thefilm 106 in the semiconductor device test apparatus e4 in the fourthembodiment with a printed board 116, as illustrated in FIG. 10.

The devices to be measured 202 are each inserted at a through hole 107 bat the positioning plate 107 and are held against the rubber sheet 131by the holding plate 109. In addition, a buffer member 113 is providedbetween each device to be measured 202 and the holding plate 109 toensure that the pressure from the holding plate 109 is distributed tothe individual devices to be measured 202 evenly and correctly.Furthermore, the rubber sheet 131 is held against the printed board 116with the pressure applied by the holding plate 109 and the printed board116 is held against the circuit board 103.

Now, the connections among the device to be measured 202, the rubbersheet 131, the printed board 116 and the circuit board 103 are explainedin reference to FIG. 11 which is an enlargement of FIG. 10.

Electrodes 116 b are formed at the surface of the printed board 116located toward the rubber sheet 131. At the surface of the printed board116 located toward the circuit board 103, electrodes 116 c are formed atpositions facing opposite the plurality of electrodes 103 c at thecircuit board 103. The electrodes 116 b and the electrodes 116c formedat different surfaces of the printed board 116 are electricallyconnected via through holes 116 d.

The rubber sheet 131 is provided with anisotropic conductive rubberportions 131 b at positions facing opposite the electrodes 116 b at theprinted board 116 and the electrodes 202 a at the device to be measured202.

When conducting a functional test on the devices to be measured 202,various types of electrical signals output by peripheral devices (notshown) and the source voltage are input to the circuit board 103 via theconnection terminals 103 a and 103 b, travel through the wiring circuitformed at the circuit board 103 and reach the electrodes 103 c. Asillustrated in FIGS. 10 and 11, the electrodes 103 c are electricallyconnected with the anisotropic conductive rubber portions 131 b embeddedin the rubber sheet 131 via the electrodes 116 c and the electrodes 116b formed at the printed board 116. In addition, the anisotropicconductive rubber portions 131 b are electrically connected with theelectrodes 202 a formed at the devices to be measured 202. Consequently,various types of electrical signals output by the peripheral devices andthe source voltage are provided to the devices to be measured 202 toelectrically drive the devices to be measured 202. In addition, thevarious types of electrical signals output by the devices to be measured202 travel through the anisotropic conductive rubber portions 131 bembedded in the rubber sheet 131 and the electrodes 116 b and 116 cformed at the printed board 116 to be taken into the circuit board 103via the electrodes 103 c and are further sent out to the peripheraldevices.

As explained above, the semiconductor device test apparatus e5 in thefifth embodiment achieves advantages similar to those achieved by thesemiconductor device test apparatus e4 in the fourth embodiment.

In addition, with the semiconductor device test apparatus e5 in thefifth embodiment which is provided with the printed board 116 to achieveelectrical connection between the devices to be measured 202 and thecircuit board 103, a reduction in the production cost is achievedcompared to the semiconductor device test apparatus e4 in the fourthembodiment provided with the film 106.

Sixth Embodiment

A semiconductor device test apparatus e6 in the sixth embodiment of thepresent invention assumes a structure that includes the circuit board103, the printed board 116, the rubber sheet 131, the positioning plate107, the holding plate 109 and the buffer members 113 that constitutethe semiconductor device test apparatus e5 in the fifth embodiment, asillustrated in FIG. 12.

However, in the semiconductor device test apparatus e6 in the sixthembodiment, the circuit board 103, the printed board 116, the rubbersheet 131 and the positioning plate 107 are integrated to constitute afirst unit 141, and the holding plate 109 and the buffer members 113 areintegrated to constitute a second unit 142.

When conducting a functional test on the devices to be measured 202, thedevices to be measured 202 are each housed inside a device-securingportion 141 a which is created by a through hole 107 b at thepositioning plate 107 constituting the first unit 141. The devices to bemeasured 202 are pressed down by the second unit 142 to be electricallyconnected with the rubber sheet 131 constituting the first unit 141. Inaddition, since the rubber sheet 131 is already electrically connectedwith the printed board 116 and the printed board 116 is alreadyelectrically connected with the circuit board 103, consequently, theelectrical signals output by the peripheral devices and the sourcevoltage are provided to the devices to be measured 202, and theelectrical signals output by the devices to be measured 202 arecommunicated to the peripheral devices.

As explained above, the semiconductor device test apparatus e6 in thesixth embodiment achieves advantages similar to those achieved by thesemiconductor device test apparatus e5 in the fifth embodiment.

In addition, since the semiconductor device test apparatus e6 in thesixth embodiment is constituted of the first unit 141 achieved byintegrating the circuit board 103, the printed board 116, the rubbersheet 131 and the positioning plate 107 and the second unit 142 achievedby integrating the holding plate 109 and the buffer members 113, it isnot necessary to assemble the circuit board 103, the printed board 116,the rubber sheet 131, the positioning plate 107, the holding plate 109and the buffer members 113 to test the devices to be measured 202 andconsequently, functional tests can be conducted on the devices to bemeasured 202 by taking a procedure similar to that adopted whenconducting functional tests using IC sockets in the prior art.Consequently, a higher degree of efficiency is achieved in functionaltests and a reduction in the cost of the tests is achieved.

It is to be noted that in the semiconductor device test apparatus e6 inthe sixth embodiment, the printed board 116 may be replaced by the film106 provided in the semiconductor device test apparatus e4 in the fourthembodiment.

Seventh Embodiment

As illustrated in FIG. 13, a semiconductor device test apparatus e7 inthe seventh embodiment of the present invention assumes a structure thatincludes a circuit board 303, a film 305, a positioning plate 307 and aholding plate 309.

The circuit board 303 is connected to peripheral devices (not shown)through connection terminals 303 a and 303 b to enable input and outputof various types of electrical signals and a source voltage. The circuitboard 303 may be constituted of, for instance, a multilayer substrate.

The film 305, the positioning plate 307 and the holding plate 309 arerespectively provided with reference holes 305 a, 307 a and 309 a at thefour corners, and are secured onto the circuit board 303 with pins 311.

The positioning plate 307 is provided with a through hole 307 bconstituting a positioning member to enable positioning of a wafer to bemeasured 401. The through hole 307 b is formed in a shape that conformswith the external shape of the wafer to be measured 401.

A plurality of ventilating through holes 309 b are formed at the holdingplate 309. This makes it possible to expose the wafer to be measured 401to the air that circulates through convection when, for instance, aburn-in is implemented on the wafer to be measured 401. It is to benoted that for applications other than burn-in, the ventilating throughholes 309 b may be omitted.

Now, the wafer to be measured 401, which is to undergo various types offunctional tests conducted by using the semiconductor device testapparatus e7 in the seventh embodiment is explained in reference to FIG.14.

The wafer to be measured 401 is resin-coated and is ultimately *dividedinto a plurality of CSP devices 411. FIG. 15 is a sectional view of aCSP device 411 along line A-A′ in FIG. 14. A plurality of electrodes 411b are provided at the surface of a device body 411 a. The electrodes 411b are land type (LGA) electrodes with flat surfaces.

FIG. 16 is a sectional view illustrating the semiconductor device testapparatus e7 in the seventh embodiment and the wafer to be measured 401immediately before the wafer to be measured 401 is mounted at thesemiconductor device test apparatus e7 for the purpose of various typesof functional tests. A buffer member 313 is provided at the holdingplate 309 at a position that faces opposite the wafer to be measured401. In addition, it is desirable to pre-assemble the circuit board 303,the film 305 and the positioning plate 307 to achieve an integratedassembly, as illustrated in FIG. 16.

Then, the wafer to be measured 401 is mounted at the semiconductordevice test apparatus e7 in the seventh embodiment as illustrated inFIG. 17. The wafer to be measured 401 is inserted at the through hole307 b at the positioning plate 307 and is pressed against the film 305by the holding plate 309. The pressure from the holding plate 309 isdistributed evenly and correctly to the wafer to be measured 401 by thebuffer member 313 provided at the holding plate 309. In addition, thefilm 305 is held onto the circuit board 303 by the pressure from theholding plate 309.

Now, the connections among the wafer to be measured 401, the film 305and the circuit board 303 are explained in reference to FIG. 18, whichis an enlargement of FIG. 17.

At the circuit board 303, a plurality of electrodes 303 c are formed atpositions that face opposite the plurality of electrodes 411 b at thewafer to be measured 401.

Bumps 305 b are formed at the surface of the film 305 located toward thewafer to be measured 401, at positions that face opposite the pluralityof electrodes 411 b at the wafer to be measured 401. These bumps 305 b,which are terminals capable of supplying source voltage andinputting/outputting various types of electrical signals, are eachformed in a semi-spherical shape through electrolytic plating. They maybe constituted of, for instance, copper, with their surfaces processedin a gold plating treatment. Alternatively, instead of the bumps,projections may be formed through etching.

Electrodes (lands) 305 c are formed at the surface of the film 305located toward the circuit board 303, at positions facing opposite theplurality of electrodes 303 c at the circuit board 303. The bumps 305 band the electrodes 305 c formed at different surfaces of the film 305are electrically connected via through holes 305 d.

When conducting a functional test on the wafer to be measured 401,various types of electrical signals output by peripheral devices (notshown) and the source voltage are input to the circuit board 303 via theconnection terminals 303 a and 303 b, travel through the wiring circuitformed at the circuit board 303 and reach the electrodes 303 c. Asillustrated in FIGS. 17 and 18, the electrodes 303 c are electricallyconnected with the electrodes 411 b formed at the wafer to be measured401 via the electrodes 305 c and the bumps 305 b formed at the film 305.Consequently, various types of electrical signals output by theperipheral devices and the source voltage are provided to the wafer tobe measured 401 to electrically drive the wafer to be measured 401. Inaddition, the various types of electrical signals output by the wafer tobe measured 401 travel through the bumps 305 b and the electrodes 305 cformed at the film 305, are taken into the circuit board 303 via theelectrodes 303 c and are further sent out to the peripheral devices.

When the semiconductor device test apparatus e7 in the seventhembodiment structured as described above, which does not include anycontacts formed through machining as in the IC sockets 3 in the priorart is adopted, a reduction in the pitch of the plurality of electrodes411 b formed at the wafer to be measured 401 can be supported. Forinstance, even when the pitch of the electrodes 411 b is equal to orless than 0.5 mm, functional tests can be conducted on the wafer to bemeasured 401.

In addition, the semiconductor device test apparatus e7 in the seventhembodiment enables various types of functional tests to be conducted atthe wafer level without dividing the wafer into chips. Thus, thenecessity for providing IC sockets for individual chips is eliminated toeliminate the cost of IC sockets.

Furthermore, by fitting the semiconductor device test apparatus e7 inthe seventh embodiment, which supports resin-coated CSP level wafers, ata test/monitor burn-in apparatus in the prior art, it becomes possibleto conduct batch tests/burn-ins.

It is to be noted that while the film 305 is provided in thesemiconductor device test apparatus e7 in the seventh embodiment, aprinted board may be utilized instead.

Eighth Embodiment

A semiconductor device test apparatus e8 in the eighth embodiment of thepresent invention assumes a structure that includes the circuit board303, a film 306, a rubber sheet 331, the positioning plate 307 and theholding plate 309 as illustrated in FIG. 19. In other words, thesemiconductor device test apparatus e8 in the eighth embodiment assumesa structure achieved by replacing the film 305 in the semiconductordevice test apparatus e7 in the seventh embodiment with the film 306 andadding the rubber sheet 331.

The film 306 and the rubber sheet 331 are respectively provided withreference holes 306 a and 331 a at the four corners and they are securedonto the circuit board 303 together with the positioning plate 307 andthe holding plate 309 by the pins 311.

The positioning plate 307 is provided with a through hole 307 bconstituting a positioning member to enable positioning of a wafer to bemeasured 402. The through hole 307 b is formed in a shape that conformswith the external shape of the wafer to be measured 402.

Now, the wafer to be measured 402, which is to undergo various types offunctional tests conducted by using the semiconductor device testapparatus e8 in the eighth embodiment is explained in reference to FIG.20.

The wafer to be measure 402 is resin-coated and is ultimately dividedinto a plurality of CSP devices 412, as in the case of the wafer to bemeasured 401 in the previous embodiment. FIG. 21 is a sectional view ofa CSP device 412 along line B-B′ in FIG. 20. A plurality of electrodes412 b are provided at the surface of a device body 412 a. The electrodes412 b are ball-type electrodes, and the CSP devices 412 are formed asBGAs.

FIG. 22 is a sectional view illustrating the semiconductor device testapparatus e8 in the eighth embodiment and the wafer to be measured 402immediately before the wafer to be measured 402 is mounted at thesemiconductor device test apparatus e8 for the purpose of various typesof functional tests. A buffer member 313 is provided at the holdingplate 309 at a position that faces opposite the wafer to be measured402. In addition, it is desirable to pre-assemble the circuit board 303,the film 306, the rubber sheet 331 and the positioning plate 307 toachieve an integrated assembly, as illustrated in FIG. 22.

Then, the wafer to be measured 402 is fitted at the semiconductor devicetest apparatus e8 in the eighth embodiment as illustrated in FIG. 23.The wafer to be measured 402 is inserted at the through hole 307 b atthe positioning plate 307 and is held against the rubber sheet 331 bythe holding plate 309. The pressure from the holding plate 309 isdistributed evenly and correctly to the wafer to be measured 402 by thebuffer member 313 provided at the holding plate 309. Furthermore, therubber sheet 331 is held against the film 306 with the pressure appliedby the holding plate 309 and the film 306 is held against the circuitboard 303.

Now, the connections among the wafer to be measured 402, the rubbersheet 331, the film 306 and the circuit board 303 are explained inreference to FIG. 24, which is an enlargement of FIG. 23.

The wafer to be measured 402, which is a BGA as explained earlier, isprovided with a plurality of solder balls constituting electrodes 412 b.

At the circuit board 303, a plurality of electrodes 303 c are formed atpositions that face opposite a plurality of electrodes 412 b at thewafer to be measured 402.

Electrodes 306 b are formed at the surface of the film 306 locatedtoward the rubber sheet 331. At the surface of the film 306 locatedtoward the circuit board 303, electrodes 306 c are formed at positionsfacing opposite the plurality of electrodes 303 c at the circuit board303. The electrodes 306 b and the electrodes 306 c formed at differentsurfaces of the film 306 are electrically connected via through holes306d.

The rubber sheet 331 is provided with anisotropic conductive rubberportions 331 b at positions facing opposite the electrodes 306 b at thefilm 306 and the electrodes 412 b at the wafer to be measured 402.

When conducting a functional test on the wafer to be measured 402,various types of electrical signals output by peripheral devices (notshown) and the source voltage are input to the circuit board 303 via theconnection terminals 303 a and 303 b, travel through the wiring circuitformed at the circuit board 303 and reach the electrodes 303 c. Asillustrated in FIGS. 23 and 24, the electrodes 303 c are electricallyconnected with the anisotropic conductive rubber portions 331 b embeddedin the rubber sheet 331 via the electrodes 306 c and the electrodes 306b formed at the film 306. In addition, the anisotropic conductive rubberportions 331 b are electrically connected with the electrodes 412 bformed at the wafer to be measured 402. Consequently, various types ofelectrical signals output by the peripheral devices and the sourcevoltage are provided to the wafer to be measured 402 to electricallydrive the wafer to be measured 402. The various types of electricalsignals output by the wafer to be measured 402 travel through theanisotropic conductive rubber portions 331 b embedded in the rubbersheet 331 and the electrodes 306 b and 306 c formed at the film 306 tobe taken into the circuit board 303 via the electrodes 303 c and arefurther sent out to the peripheral devices.

As explained above, the semiconductor device test apparatus e8 in theeighth embodiment achieves advantages similar to those achieved bysemiconductor device test apparatus e7 in the seventh embodiment.

It is to be noted that it is necessary to take into consideration apossible deformation of the ball-shaped electrodes when conductingvarious types of functional tests on BGAs such as the wafer to bemeasured 402. In the case of the semiconductor device test apparatus e8in the eighth embodiment, which is provided with the rubber sheet 331that achieves elasticity and at the same time enables electricalconnection only in the thicknesswise direction, the electrodes 412 bformed at the wafer to be measured 402 do not become deformed. Theanisotropic conductive rubber portions 331 b provided at the rubbersheet 331 come in contact with the ball-shaped electrodes 412 b providedat the wafer to be measured 402 over a larger area due to theirelasticity. Thus, when the semiconductor device test apparatus e8 in theeighth embodiment is employed, the wafer to be measured 402 achievereliable electrical connection with the peripheral devices to enablefunctional tests to be performed at a higher degree of accuracy.

It is to be noted that while the film 306 is provided at thesemiconductor device test apparatus e8 in the eighth embodiment, aprinted board may be utilized, instead.

Ninth Embodiment

A semiconductor device test apparatus e9 in the ninth embodiment of thepresent invention adopts a structure that includes a circuit board 503,probes 511, a probe sheet 521 and a rubber sheet 531, as illustrated inFIG. 25.

The circuit board 503 is connected to peripheral devices (not shown) toallow input and output of various types of electrical signals and asource voltage.

The probes 511 are constituted of tungsten or beryllium copper. Inaddition, contact portions 511 a of the probes 511 where they come incontact with the rubber sheet 531 are clad with gold plate to preventoxidation and to assure good contact. It is to be noted that thegold-plating treatment is not restricted to be implemented on thecontact portions 511 a only, and may be implemented over the entiresurfaces of the probes 511.

The probe sheet 521 may be constituted of a rubber sheet having a heatresistant property or a membrane sheet formed from glassfiber/polyimide. In addition, the probes 511 are embedded in the probesheet 521, and are each provided with notches 511 b as illustrated inFIG. 26 to ensure that they do not slip out of the probe sheet 521.

The rubber sheet 531 is provided with anisotropic conductive rubberportions 531 a to electrically connect a plurality of electrodes 503 aformed at the circuit board 503 and the contact portions 511 a at theplurality of probes 511.

Now, a wafer to be measured upon which various types of functional testsmay be conducted employing the semiconductor device test apparatus e9 inthe ninth embodiment is explained. As an example to facilitate theexplanation, an IC chip 601 formed in one partitioned area of the waferto be measured is illustrated in FIG. 27. The IC chip 601 is providedwith a plurality of pads 601 a. Normally, the pads 601 a will beconstituted of aluminum. In addition, the entire area of the IC chip 601where the pads 601 a are not present (in particular, the area where thecircuit is formed) is protected from the outside atmosphere by a resistfilm 601 b.

When conducting various types of functional tests on the IC chip 601employing the semiconductor device test apparatus e9 in the ninthembodiment, the individual probes 511 are placed in contact with thecorresponding pads 601 a as illustrated in FIG. 28. As described above,since no resist film 601 b is formed at the pads 601 a, the pads 601 aand the probes 511 become electrically connected.

When conducting a functional test on the IC chip 601, various types ofelectrical signals output by the peripheral devices (not shown) and thesource voltage are input to the circuit board 503, travel through thewiring circuit formed at the circuit board 503 and reach the electrodes503 a. During this process, the electrodes 503 a are electricallyconnected with the probes 511 via the anisotropic conductive rubberportions 531 a provided at the rubber sheet 531, as illustrated in FIG.25. Consequently, the various types of electrical signals output by theperipheral devices and the source voltage are provided to the IC chip601 via the probes 511 to electrically drive the IC chip 601. Inaddition, various types of electrical signals output by the IC chip 601travel through the probes 511 and the anisotropic conductive rubberportions 53 1 a provided at the rubber sheet 531 to be taken into thecircuit board 503 via the electrodes 503 a and they are then sent out tothe peripheral devices.

In addition, even if slight level differences are formed at theindividual pads due to, for instance, the laminated structure assumed bythe IC chip 601, these stages are absorbed by the rubber sheet 531 andthe probe sheet 521 so that the individual probes 511 come into contactwith the pads 601 a formed at the IC chip 601 with a high degree ofreliability. Furthermore, some margin is obtained in regard to theaccuracy of the front end alignment for the individual probes 511 whenmanufacturing the semiconductor device test apparatus e9 in the ninthembodiment.

As explained above, in the semiconductor device test apparatus e9 in theninth embodiment provided with the probes 511, which are constituted oftungsten or beryllium copper and are placed in contact with the objectof testing, durability against contact is achieved that is comparable tothat of a probe card 13 in the prior art. Thus, the semiconductor devicetest apparatus e9 in the ninth embodiment may be employed in a productinspection process as well as in functional tests conducted during thesemiconductor device development stage.

Furthermore, the semiconductor device test apparatus e9, which assumes astructure in which the front ends of the probes 511 are placed incontact with the object of testing in a perpendicular attitude, iscapable of supporting a finer pitch of the pads at the object of testing(e.g. an electrode pitch of 0.5 mm or smaller). In addition, it ispossible to place the probes 511 in contact with all the pads formed atthe object of testing simultaneously. Also, the probes 511 may beembedded in the probe sheet 521 through an automated process to achievea low production cost for mass production.

Moreover, the semiconductor device test apparatus e9 in the ninthembodiment may be combined with a wafer-level test/burn-in apparatus.This will make it possible to reduce the level of investment in thetester employed in tests on finished semiconductor device products,which ultimately leads to reductions in the test cost and the devicecost.

While the invention has been particularly shown and described withrespect to preferred embodiments thereof by referring to the attacheddrawings, the present invention is not limited to these examples and itwill be understood by those skilled in the art that various changes inform and detail may be made therein without departing from the spirit,scope and teaching of the invention.

As has been explained, according to the present invention, tests onsemiconductor devices having electrodes provided at a fine pitch can beconducted with ease and at low cost. In addition, the durability of thesemiconductor device test apparatus against repeated tests can beimproved. Furthermore, since batch-testing of a great number ofsemiconductor devices is enabled, higher efficiency in testing isachieved.

The entire disclosure of Japanese Patent Application No. 11-66621 filedon Mar. 12, 1999 including specification, claims, drawings and summaryis incorporated herein by reference in its entirety.

1. A method of testing circuit elements on a semiconductor wafer, themethod comprising: providing a semiconductor wafer of which a wafersurface is coated with a resin, wherein the wafer surface has aplurality of electrodes formed thereon and connected to the circuitelements, and wherein the resin is to form an outer layer of packagedsemiconductor devices formed by dividing the resin-coated semiconductorwafer, the resin leaving exposed the electrodes; inserting thesemiconductor wafer into a burn-in apparatus; and testing the circuitelements of the semiconductor wafer for electrical functions in theburn-in apparatus through the electrodes.
 2. The method of testingcircuit elements on a semiconductor wafer according to claim 1, whereinthe semiconductor wafer is exposed to convective air in the burn-inapparatus.
 3. The method of testing circuit elements on a semiconductorwafer according to claim 1, wherein a pitch of the electrodes is equalto or less than 0.5 mm.
 4. The method of testing circuit elements on asemiconductor wafer according to claim 1, wherein the semiconductorwafer is mounted on a circuit board during a burn-in process.
 5. Themethod of testing circuit elements on a semiconductor wafer according toclaim 4, wherein the semiconductor wafer is mounted on the circuit boardvia an elastic sheet.
 6. The method of testing circuit elements on asemiconductor wafer according to claim 4, wherein the semiconductorwafer is mounted on the circuit board via a film.
 7. The method oftesting circuit elements on a semiconductor wafer according to claim 4,wherein the semiconductor wafer and the circuit board are fixed by apositioning plate.
 8. The method of testing circuit elements on asemiconductor wafer according to claim 1, wherein the semiconductorwafer is fixed by a holding plate.
 9. The method of testing circuitelements on a semiconductor wafer according to claim 8, wherein theholding plate has a plurality of through holes.